Portada

THROUGH SILICON VIAS IBD

CRC PRESS
06 / 2020
9780367574543
Inglés

Sinopsis

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

PVP
88,72